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Goal:

Optimization of heat transfer from server CPU to heat sink with limited space available. Due to the small geometry of server casings in data centers, the heat produced by the CPU needs to be transported the outside of the server housing. Conventional water cooling could not be used because of the sensitivity of the electronics.

Heatpipe connection

Approach:

Using LEM and FEM analysis a heat pipe layout and thermal heat sink was designed and analyzed to accomplish sufficient heat transport. Heat pipe size, quantity, medium and pressure are all optimized for minimal thermal resistance from CPU to the external heat sink which is situated “far” from the CPU’s heat source.

LEM heatpipe

Results:

Using the proposed thermal layout it was possible to dissipate high amounts of power at a minimal temperature gradient from CPU to the heat sink.

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